November 2006
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Under the Hood: Inside the Nintendo Wii

EETimes teardown the new Nintendo Wii.

IBM Broadway processor;
ATI Hollywood graphics processor;
Broadcom BCM2042 wireless sensor with Bluetooth functionality,
Broadcom BCM4318 Wi-Fi transceiver;
Qimonda HYB18HS1232 GDDR3 graphics RAM;
Samsung K9F4G08U0A 65-nm, 4-Gbit NAND flash; and Elpida S1616AGTA 16-Mbit SDRAM.

Full Article and Video Here:

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